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As a leading UK distributor of Inventec Performance Chemicals, Guyson supplies a comprehensive range of THERMASOLV dielectric cooling fluids for immersion cooling and direct liquid cooling (DLC) applications. Designed for modern data centres, artificial intelligence infrastructure and high-performance computing environments, these advanced cooling fluids help improve thermal efficiency, reduce energy consumption and support higher rack densities.
With increasing demand for AI processing power and hyperscale data centre capacity, dielectric cooling has emerged as one of the most effective alternatives to traditional air-cooling methods. Guyson provides access to Inventec's proven THERMASOLV range, for single-phase, two-phase and direct cooling systems.
Key Benefits of THERMASOLV Dielectric Cooling Fluids
- Optimised Thermal Performance – Efficiently removes heat from high-density computing environments, helping maintain reliable operating temperatures for servers, CPUs and GPUs.
- High Electrical Insulation – Dielectric properties allow fluids to be used safely around powered electronic and electrical equipment.
- Supports AI and High-Performance Computing – Designed for demanding applications including AI data centres, HPC clusters, hyperscale facilities and high-power electronics.
- Enhanced Safety and Equipment Protection – The range includes non-flammable, thermally stable fluids with broad compatibility across metals, plastics and elastomers.
- Sustainability-Focused Options Available – Low and ultra-low GWP alternatives help organisations reduce environmental impact and support ESG and sustainability goals.
Single-Phase Immersion Cooling Fluids
Single-phase immersion cooling involves submerging IT equipment in a dielectric fluid that remains in a liquid state throughout operation. This delivers highly effective heat transfer while simplifying cooling system design.
THERMASOLV CF1
THERMASOLV CF1 is designed for single-phase immersion cooling and direct cooling systems where thermal stability, electrical insulation and safety are critical. Its low viscosity and excellent material compatibility help maximise heat transfer whilst protecting sensitive electronic equipment.
CF1 Technical Highlights
- Boiling Point: 170°C
- Dielectric Strength: >40 kV
- Critical Temperature: 300°C
THERMASOLV CF2
THERMASOLV CF2 is designed for organisations seeking an effective balance between immersion cooling performance and environmental responsibility. With a low GWP profile and strong dielectric properties, it supports efficient thermal management in modern data centre environments.
CF2 Technical Highlights
- Boiling Point: 110°C
- Dielectric Strength: 39 kV
- Global Warming Potential (GWP): <120
THERMASOLV CF3
THERMASOLV CF3 is one of Inventec's highlighted cooling solutions, offering excellent immersion cooling performance combined with a significantly reduced environmental impact. It is ideally suited to organisations looking to future-proof cooling systems while supporting sustainability targets.
CF3 Technical Highlights
- Boiling Point: 120°C
- Dielectric Strength: >35.7 kV
- Low GWP <108
Two-Phase Immersion Cooling Fluids
For high-density computing environments, two-phase immersion cooling offers exceptional thermal performance by utilising controlled fluid evaporation and condensation to remove heat efficiently. This technology is increasingly adopted within AI, GPU and hyperscale computing facilities.
THERMASOLV IM2
THERMASOLV IM2 is engineered for two-phase immersion cooling systems, delivering efficient heat removal through phase-change cooling while maintaining an exceptionally low environmental impact.
IM2 Technical Highlights
- Boiling Point: 49°C
- Dielectric Strength: >40 kV
- Critical Temperature: <10
THERMASOLV IM6
THERMASOLV IM6 is one of Inventec's flagship dielectric cooling fluids. Developed for two-phase immersion cooling and direct cooling systems, it offers exceptional dielectric strength, outstanding thermal performance and industry-leading sustainability credentials
IM6 Technical Highlights
- Boiling Point: 47°C
- Dielectric Strength: 79 kV
- Ultra-Low GWP: 1
Direct-To-Chip Cooling Fluids
Direct-to-chip cooling (also known as Direct Liquid Cooling or DLC) circulates coolant through cold plates attached directly to high-heat-generating components such as CPUs and GPUs. This targeted approach delivers exceptional thermal management while supporting increasingly powerful computing hardware.
THERMASOLV IM1
THERMASOLV IM1 is designed for direct liquid cooling applications where heat must be removed efficiently from high-performance processors and electronic components. Its balance of cooling performance and dielectric protection makes it suitable for a wide range of data centre environments.
IM1 Technical Highlights
- Boiling Point: 61°C
- Dielectric Strength: 28 kV
- Global Warming Potential (GWP): 320
THERMASOLV IM7
THERMASOLV IM7 combines direct liquid cooling performance with a significantly lower GWP profile, making it an attractive option for organisations seeking both operational efficiency and reduced environmental impact.
IM7 Technical Highlights
- Boiling Point: 76°C
- Dielectric Strength: >25 kV
- Very-Low GWP: 61
Why Choose Guyson as Your Inventec Distributor?
Guyson combines technical expertise with access to Inventec's market-leading dielectric cooling products, helping customers identify the most suitable cooling solution for their application. Whether you're designing a new immersion-cooled facility or upgrading existing data centre infrastructure, Guyson can help you implement an effective and future-ready cooling strategy. Contact the team today to discuss your requirements in detail.
FAQs
What Are Dielectric Cooling Fluids?
Dielectric cooling fluids are electrically non-conductive liquids specifically engineered to absorb and transfer heat away from servers, processors and electronic components without damaging sensitive equipment.
Compared with conventional air cooling, dielectric cooling technology offers:
- Higher cooling efficiency
- Reduced power consumption
- Increased server density
- Lower infrastructure costs
- Improved equipment reliability
- Enhanced sustainability performance
What is GWP (Global Warming Potential)?
Global Warming Potential (GWP) is a measure of how much heat a greenhouse gas traps in the atmosphere compared to carbon dioxide (CO₂), which has a reference value of 1.
- CO₂ = GWP of 1
- GWP 10 = 10 times the warming impact of CO₂
- GWP 100 = 100 times the warming impact of CO₂
- GWP 1,000 = 1,000 times the warming impact of CO₂
For cooling fluids, GWP helps determine the potential environmental impact if the fluid is being released into the atmosphere.
Why Does GWP Matter in Data Centre Cooling?
As data centres scale to support AI, machine learning and HPC workloads, operators are increasingly focused on reducing their environmental footprint.
Selecting a dielectric fluid with a lower GWP can help:
- Support sustainability and ESG objectives
- Reduce the environmental impact of fluid leaks
- Meet corporate carbon reduction targets
- Future-proof cooling systems against evolving environmental regulations
- Improve eligibility for green building and sustainability certifications
For operators investing in new immersion cooling infrastructure, thermal performance is important but so is the environmental profile of the fluid itself.
What are typical applications for Inventec Dielectric Cooling Fluids
Inventec’s advanced cooling fluids support a wide range of industries and technologies, including:
Artificial Intelligence (AI) Data Centres
Maintain optimal temperatures for GPU-intensive AI training and inference workloads.
High-Performance Computing (HPC)
Support scientific computing, research facilities and advanced engineering simulations.
Hyperscale Data Centres
Enable efficient cooling of large-scale cloud and colocation environments.
Enterprise Data Centres
Reduce energy costs and improve operational efficiency.
High-Power Electronics
Protect sensitive electronic systems operating under extreme thermal conditions.
What are direct liquid cooling solutions for high-power computing?
As processor power requirements continue to increase, Direct Liquid Cooling (DLC) is becoming an essential technology for data centres and AI clusters.
Direct liquid cooling removes heat directly from critical components such as CPUs and GPUs, enabling higher computational performance while improving energy efficiency. Inventec’s cooling solutions help operators manage increasing thermal loads and support the next generation of high-performance computing infrastructure.